In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Adobe on Wednesday announced the latest evolution of its 3D technology with the launch of the Substance 3D collection, a suite of tools and services for 3D content design. The Substance 3D collection ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Dowina is an acoustic guitar manufacturer based in Bratislava, Slovakia. In a market brimming with boutique suppliers and numerous well-known brands, a key aspect of Dowina’s market approach is the ...

Southern New Hampshire’s leading landscaping and hardscaping company is redefining outdoor space planning with its innovative use of 3D design technology. With our 3D design services, our clients can ...

In a press conference held in Feb. 2025 at 3D Experience World in Houston, Machine Design learned about the Electrospider from Bio3DPrinting. The company was spun off from Italy’s University of Pisa, ...

California lawsuits and Colorado file limits target 3D printing STL and G-code sharing. With background checks, waiting ...

Premium clothing retailer Tommy Hilfiger is implementing 3D design technology into all global apparel design teams at its headquarters in Amsterdam, the Netherlands. The commitment builds on the ...

A custom wooden acoustic diffuser featuring a pixelated portrait of Salvador Dali, handcrafted by WoodXEL, showcasing the blend of advanced 3D design technology and expert craftsmanship. WoodXEL’s ...

In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...